At rinf.tech, innovation is part of our DNA. Our dedicated team was on the ground at Embedded World 2025, engaging with global industry leaders, exploring the latest technological challenges, and seizing new opportunities. With extensive expertise in delivering advanced solutions, from security firmware and platform integration to our revolutionary LiDAR-based safety solution, our presence at this prestigious event was essential.
The insights and connections gained from our active participation have enriched our understanding of emerging trends and will directly influence our ongoing and future projects.
We’re excited to share the top 10 insights from Embedded World 2025, which offer a glimpse into the future of embedded systems and demonstrate how technological advancements are reshaping the industry.
In a significant move highlighting the evolving landscape of automotive electronics, NXP Semiconductors introduced the S32K5 automotive microcontrollers, the 16nm FinFET automotive MCU featuring embedded MRAM. Engineered for software-defined vehicle architectures, these microcontrollers offer enhanced reliability, superior performance, and energy efficiency critical for next-generation automotive systems. Moreover, NXP further strengthened its position in edge computing with the acquisition of Kinara, enhancing its edge AI portfolio with high-performance, low-power computing capabilities tailored for real-time processing at the vehicle level.
Qualcomm made a bold statement at Embedded World 2025 with the unveiling of its Dragonwing industrial IoT platform. Designed to thrive in harsh industrial environments, Dragonwing integrates advanced AI, robust connectivity, and comprehensive safety features into a single scalable solution. This platform is poised to transform industrial operations by enabling real-time data processing and predictive maintenance, all while ensuring secure, reliable communication across industrial networks. Complementing this hardware innovation, Qualcomm’s recent acquisition of Edge Impulse bolsters its AI software ecosystem, paving the way for complex edge-centric AI applications across multiple industries.
At Embedded World 2025, ASUS IoT showcased its latest suite of intelligent edge computing and AI solutions. The company’s offerings are designed to support the seamless integration of connected devices, delivering real-time analytics and decision-making capabilities at the edge. With a focus on enhancing data security and ensuring low-latency processing, ASUS IoT’s innovations are set to empower industries ranging from smart cities to industrial automation, offering scalable solutions for complex IoT ecosystems.
Arm took center stage with its groundbreaking edge AI computing platform, which features the ultra-efficient Cortex-A320 CPU paired with the Ethos-U85 microNPU. Built on the advanced Armv9 architecture, the Cortex-A320 delivers a 10x improvement in machine learning performance over its predecessors while also offering robust security features, such as Pointer Authentication, Branch Target Identification, and Memory Tagging Extension, to safeguard sensitive operations in exposed environments.
This innovative platform significantly boosts on-device AI inferencing capabilities. It reduces power consumption, making it ideal for IoT and edge applications ranging from smart cameras and autonomous vehicles to industrial automation systems. The integration of the Ethos-U85 NPU ensures efficient acceleration of complex AI workloads, including the execution of large-scale models with over one billion parameters.
AMD made a significant statement at the event by announcing its latest 5th Generation EPYC embedded processors. These processors bring server-grade performance into the embedded arena, offering superior multi-threading capabilities, improved energy efficiency, and enhanced security features. Designed to meet the rigorous demands of modern industrial and edge applications, AMD’s EPYC processors are set to revolutionize how embedded systems handle complex computational tasks in a compact footprint.
Thundercomm stole the spotlight by introducing the Turbox C6690 SOM – an AI-ready, ultra-compact module tailored for industrial handheld applications. This innovative system-on-module (SOM) combines robust artificial intelligence capabilities with a small form factor, making it ideal for edge computing in harsh industrial environments. Its design ensures enhanced real-time processing while maintaining energy efficiency, offering a competitive advantage for companies looking to deploy innovative industrial solutions.
SanDisk introduced its new automotive-grade UFS4.1 storage solution at Embedded World 2025, marking a substantial upgrade for the automotive sector. Engineered for high performance and reliability, this storage technology is specifically designed to support modern vehicles’ demanding data throughput and durability requirements. With faster data access speeds and robust endurance, SanDisk’s UFS4.1 storage is ideal for applications ranging from infotainment systems to advanced driver-assistance systems (ADAS).
Intel made a splash with its Core Ultra 300 “Panther Lake” CPU, which was showcased at the event as a key driver of high-performance computing in the embedded space. This new processor is engineered to deliver unprecedented performance and energy efficiency, making it a top choice for applications that demand rapid processing and robust computational power. With enhanced capabilities, the Core Ultra 300 is set to accelerate industrial automation, robotics, and edge computing developments.
BrainChip captivated audiences by demonstrating its advanced gesture recognition capabilities powered by event-based vision technology. This breakthrough system facilitates real-time human-machine interaction, offering new possibilities for robotics, automation, and wearable technologies. BrainChip’s solution delivers highly efficient processing by leveraging brain-inspired architectures, enabling devices to understand and react to gestures with exceptional speed and accuracy.
Rounding out an impressive lineup of innovations, our colleagues at rinf.tech unveiled a state-of-the-art LiDAR-based safety solution at the event. Designed to elevate workplace safety, this advanced system integrates high-performance LiDAR sensors with intelligent software to provide comprehensive monitoring across expansive and irregularly shaped areas. Unlike traditional safety barriers that rely on laser or infrared technologies, our solution offers exceptional flexibility by creating dynamic, software-defined safety zones that can be tailored to specific workplace layouts. This proactive system detects potential hazards in real-time and logs safety events for detailed analysis, ensuring a robust and adaptive safety environment.
In addition, our team showcased the Automotive Driving Monitoring System, our latest automotive innovation. This solution continuously monitors the driver’s facial orientation and eye openness to detect signs of distraction or drowsiness. With integrated facial recognition, it supports personalized settings for individual drivers, seamlessly combining enhanced safety with improved comfort for a superior driving experience.
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Embedded World 2025, held in Nuremberg between March 11 and 13, has once again proven to be a pivotal event for innovators, developers, and thought leaders in the embedded systems and software engineering space.
Join rinf.tech at Embedded World 2025 to explore a new era in embedded innovation. At Booth 5-381 in Hall 5, discover our advanced LiDAR-Based Workplace Safety Solution—a system designed to enhance safety through dynamic, software-defined zones, real-time alerts, and intelligent operational insights. Learn how this versatile solution can be applied to diverse environments, from construction sites to production floors, ensuring a proactive approach to hazard detection and operational efficiency.
Straight from the source: diving into the most captivating and forward-thinking highlights from CES 2025, directly witnessed and experienced by our team.
