The Embedded World North America conference, held on October 8-10, 2024, has once again proven to be a vital event for innovators, developers, and thought leaders in the embedded systems and software engineering space. This year’s conference showcased cutting-edge technologies, groundbreaking solutions, and trends poised to shape the future of automotive, IoT, wearables, and semiconductors.
At rinf.tech, embedded software engineering is deeply embedded in our DNA, and attending this prestigious event allowed our US team to engage with global industry peers, discuss the latest challenges, and explore new opportunities. With over a decade of expertise in delivering ASPICE and ISO26262-compliant solutions across critical domains such as platform integration, security firmware, and advanced driver assistance systems (ADAS), our presence at Embedded World North America was essential.
Our rinf.tech US team attended this pivotal event, gathering key insights and engaging with the forefront of innovation in embedded technology. Their participation gave us a wealth of knowledge, highlighting emerging trends and advancements that will directly influence our ongoing and future projects.
We’re excited to share the top 10 insights from this year’s Embedded World North America, offering a glimpse into the future of embedded systems and how these developments are shaping the industry.
At Embedded World North America 2024, NEXCOM presented the ATC 3750-IP7-6C, a ruggedized AI-powered computer designed for autonomous vehicles and railway systems. Built on the NVIDIA Jetson AGX Orin™ platform, this system offers high-performance AI processing with up to 275 TOPS (INT8), designed to handle advanced AI workloads such as autonomous driving, machine learning, and edge inference. The system supports in-vehicle and railway applications, ensuring reliable performance in harsh environments with wide operating temperatures of -20°C to 70°C.
With its IP67 rating, the ATC 3750-IP7-6C is equipped to handle data-intensive applications like obstacle detection and AI-enhanced vision systems, ensuring real-time analytics and collision avoidance capabilities. The device also integrates various high-speed connectivity options, including 6 PoE+ ports for IP CAMs and LiDAR sensors, making it ideal for autonomous mobility and safety-critical environments.
SECO, a leading player in embedded systems, showcased its Clea IoT platform–an industrial-grade Linux-based OS that streamlines IoT deployment with integrated device management and data orchestration. It provides a seamless path to bringing AI to the edge, making IoT deployments more efficient and secure.
In partnership with Qualcomm, SECO also presented a new system-on-module (SoM) based on the Qualcomm 6490 processor, which targets edge AI and IoT applications. This collaboration ensures that SECO’s embedded products are at the forefront of innovation, particularly in industrial sectors where AI-driven solutions can transform operations.
Premio Inc. unveiled its RCO-3000-RPL Series, a super-rugged industrial computer designed for harsh environments and powered by the 13th Gen Intel® Core™ processors. This small form factor (SFF) computer is engineered for real-time processing, combining IoT connectivity with modular I/O scalability for industrial edge applications.
The RCO-3000-RPL Series offers versatile deployment options, ideal for industries like manufacturing, energy, and logistics, where high-performance computing is essential for automation, monitoring, and control. Its ruggedness and modularity make it a reliable solution for handling complex edge AI tasks.
Secure-IC introduced its Securyzr neo–Core Platform, designed to deliver customizable security solutions across a variety of sectors, including automotive, IoT, and industrial applications. This platform allows for flexible configurations that include Crypto co-processors and IPs, providing tailored protection to meet the specific needs of each industry.
The platform’s modular design ensures that companies can scale their security infrastructure as needed, addressing critical security challenges, especially in an era where IoT devices are increasingly susceptible to cyber threats.
MosChip Technologies showcased its comprehensive MosChip DigitalSky suite, designed to transform global enterprises with integrated digital solutions. By leveraging technologies such as IoT, Cloud, AI, and Automation, DigitalSky provides a scalable platform for enhancing operational effectiveness and stakeholder experience. MosChip’s platform promises to drive intelligent connectivity across diverse business functions.
DigitalSky’s ability to bridge gaps between IT, operations, and product management helps organizations become more agile and responsive to the rapidly changing digital landscape. With its focus on operational efficiency and productivity, the suite provides a holistic framework for enterprises looking to embed intelligence into every aspect of their business processes.
Wirepas demonstrated its robust and self-healing mesh network technology, which is designed for smart industry, city, and retail environments. The technology excels in harsh, noisy environments by enabling continuous communication between nodes, even when infrastructure components fail. With its ability to self-organize and re-route in real time, Wirepas sets new standards for reliable industrial communications.
By avoiding the need for a pre-installed infrastructure, Wirepas’s mesh network technology offers a more flexible and scalable solution for industries that operate in dynamic or challenging environments. This capability ensures operational continuity and reduces downtime, even in the event of significant disruptions, making it ideal for critical applications in manufacturing, energy, and logistics.
At Embedded World North America 2024, ASUS showcased its PE1000N AI Edge Box, an ultra-compact and fanless AI system designed specifically for edge computing applications. Built on the NVIDIA® Jetson™ platform, the PE1000N delivers powerful AI inference capabilities, making it ideal for real-time AI workloads such as computer vision, smart automation, and IoT applications. Its compact size and robust design allow it to operate effectively in industrial environments, handling temperatures ranging from -20°C to 60°C, while also supporting diverse I/O interfaces for seamless connectivity.
The PE1000N is especially optimized for smart manufacturing and automation, supporting applications like automated guided carts (AGCs) and autonomous mobile robots (AMRs). With up to 21 TOPS of AI computing power, this system is designed to offer high efficiency while consuming low power, making it an ideal choice for industries requiring scalable, energy-efficient AI solutions at the edge.
Rambus introduced its HBM4 Memory Controller IP, the industry’s first of its kind, aimed at delivering superior memory performance for AI accelerators, graphics, and high-performance computing (HPC) applications. The controller maximizes bandwidth utilization and throughput, helping companies in AI and HPC deploy next-generation memory solutions with optimized power and performance.
The HBM4 Controller IP core is designed to meet the growing demands of AI-driven workloads, which require higher memory bandwidth and lower latency. Rambus’s solution provides a reliable, high-performance option for organizations working in fields such as machine learning, data analytics, and virtual reality, where processing large amounts of data quickly is crucial.
Edge Impulse showcased its revolutionary FOMO-AD (Fast Objects More Objects-Anomaly Detection) technology, which enables visual anomaly detection on any edge device. This scalable system is the first of its kind to train models in real-time, significantly boosting the productivity of visual inspection systems by detecting anomalies without requiring manual intervention.
This technology can be deployed across a range of devices, from NVIDIA GPUs to Arm MCUs, allowing industries like manufacturing and healthcare to implement automated visual inspection systems that increase operational efficiency while reducing costs.
At Embedded World North America, our partner NXP Semiconductors showcased a series of innovations to simplify the development of Edge AI, IoT, and automotive solutions. One of the highlights was the “Simplifying Edge AI Development” session, presented by Anthony Huereca, which explored how automated model discovery streamlines AI implementation on edge devices. Additionally, NXP hosted a hands-on workshop led by Charlie Ice and Nicolas Santana that fast-tracked IoT development using NXP’s wireless MCUs, providing attendees with practical insights into rapid IoT project deployment.
The company also presented forward-thinking sessions such as “Simplifying Automotive ECU Consolidation with Advanced SoCs” and discussions on the upcoming cybersecurity regulation landscape, positioning NXP as a leader in secure, scalable, and efficient embedded solutions across industries.
Revealing groundbreaking partnerships, state-of-the-art technologies, and visionary insights from the “Woodstock of AI” by NVIDIA.
Recapping MWC 2024, from unveiling the latest in 6G R&D to showcasing solutions that promise to drive economic growth and society’s well-being in the years to come.
Sharing Top 10 thought-provoking takeaways from CES 2024.
